Material Characterization
and Metrology

R&D and Production solutions for tomorrows micro-electronic device suppliers

Semi-automated and fully automated systems for high and low-volume production environments. Toho high-performance metrology systems provide thin film & materials characterization systems used to monitor film stress, physical, optical, electrical and material characteristics of HB-LED, compound semiconductor, strained silicon and silicon-on-insulator (SOI) devices, including composition, crystal structure, layer thickness, dopant concentration, contamination and electron mobility.

FLX Series

Stress Measurement

TohoSpec 3100

Film Thickness

QuickPRO-3D *

Non-Contact 3D Surface Profiler


Dual-Surface Geometry Characterization

QuickOCT-4D *

4D Surface & Thick-Film Profiler

4 Point Probe


FP Series

Contact Profiler

NanoSpec 6500

Film Thickness

FPM Series

Optical Profiler

* Opto Alignment products distributed by Toho Technology, Inc.