Material Characterization
and Metrology

R&D and Production solutions for tomorrows micro-electronic device suppliers

Semi-automated and fully automated systems for high and low-volume production environments. Toho high-performance metrology systems provide thin film & materials characterization systems used to monitor film stress, physical, optical, electrical and material characteristics of HB-LED, compound semiconductor, strained silicon and silicon-on-insulator (SOI) devices, including composition, crystal structure, layer thickness, dopant concentration, contamination and electron mobility.

FLX Series

Stress Measurement

TohoSpec 3100

Film Thickness

FP Series

Contact Profiler

NanoSpec 6500

Film Thickness

FPM Series

Optical Profiler

4 Point Probe