Precision Wet Process

Clean, Etch and Strip Process Equipment for Display and Architectural Glass

Toho Precision Cleaners

Toho Precision Cleaners have met the demands of an ever changing market place for over 30 years. The need to achieve high cleaning efficiency on substrates of all sizes, shapes, thicknesses and materials means that customer needs drive the design and function of our products. Toho realizes that while some applications are focused on sub-micron particle removal, others demand robust throughput at economical price points. Toho Technology Wet Process Solutions offer outstanding value with additional benefits that make Toho the clear best choice for long term intensive performance. Toho is an approved vendor for all leading Asian glass manufacturers, two (2) major Medical Imaging Sensor manufacturers in the United States as well as Architectural and Dynamic glass manufacturers. In-Line and Spin Models for virtually any size glass are available.


Modular Configuration

  1. Robot Load / Un-load, Manual Load, Indexed Elevator, Loader Conveyor
  2. Cassette / Panel ID Read, Record
  3. Conveyance system with lateral guides
  4. UV Excimer Cleaner to remove Organic substances
  5. Alkaline/acidic cleaning or Chemical Free Cleaning
  6. Brush Cleaning (Disc or Roll) (Surfactant Application)
  7. Cascade Rinse with separate supply of the final cascade module
  8. Mach Jet™ – for sub µm particles / special nozzle mixes 0.5MPa DIW and 0.4MPa CDA
  9. Final DIW Rinse
  10. Air Knife high pressure CDA or N2
  11. Un-Load

Quality Build

  • Modular PP Construction
  • Easy access Maintenance openings
  • Double glass covers
  • Fully enclosed Process Chambers
  • Positive air pressure
  • Built-in exhaust
  • Multiple safety interlocks, leak sensors, exhaust sensors, over-heat, dry pump and other built-in safety systems
  • Effective particle filtering system

Optional Processes

Spin Wash, Rinse, Dry instead of In-Line system

  • Auto Width Adjustments for Various Panel Sizes
  • Nearly contact-free conveyance system
  • HPMJ: “Hyper Pressure Mach Jet” shower for maximum particle removal
  • CO2 insertion system for ESD suppression
  • Integrated Air Knife blower
  • HEPA filtration
  • Bacteria Prevention systems to stop water born contaminants
  • Ionizers in critical ESD control areas – Unload module
  • Safety light curtains at openings
  • CIM / Host PC interface
  • Wet Etch, Strip, Cassette Cleaners



  • Engineered for throughput, facility requirements
  • Full Pre-Assembly Spec Review for customer Engineering and Material changes
  • In-line roller conveyor automated systems
  • Lower Throughput Applications
  • Stand alone systems
  • Limited footprint requirements
  • Manual Load / Unload
  • Bacteria Prevention systems to stop water born contaminants

Outstanding Customer Support

  • Maintenance & Operations Training at Source & Site acceptance
  • Training for all Preventative Maintenance & Repair techniques
  • Bilingual Assistance as needed
  • Trained Service Technicians on-site during and after installations
  • Local US Service Technician Presence
  • Optional Remote Access software for troubleshooting and programming assistance
  • PLC programming support
  • Global Compliance
  • NFPA codes and regulations, NEC, OSHA
  • CE Compliance as needed
  • SEMI S2-93A

Engineered for Quality Performance

  • Designed with Japanese Quality Standards and attention to detail and workmanship
  • Low Cost of Ownership with best in class material grades
  • User Friendly Software Interface customized to unique applications
  • Reduced Environmental impact with noise suppression, filtration systems and re-circulation systems
  • N2 Purge to Prevent bacteria build up
  • ESD Suppression with Ionizer bars at Un-Load
  • Automatic Chamber cleaning
  • Automatic line purge


Displays / Clean Room

  • Incoming Glass Clean
  • Pre-Lithography Clean
  • Pre-Deposition
  • Pre-Etch Clean
  • Cover Glass Clean
  • Post Scribe Clean

Architechtural / Industrial

  • Incoming Clean (removal of packing materials, grease, shards, etc)
  • Pre-Process Clean
  • Clean Polish & Clean Combination Machines
  • Post-Process Clean

R&D / Low Through-Put

  • Stand Alone Manual Clean
  • Spin Clean
  • Limited Foot Print “Double Decker” Clean
  • Manual Load /Unload
  • Bacteria Prevention to eliminate water born contaminants


Full Range

  • Substrate sizes up to G10
  • Optional Multiple size glass on one Cleaner
  • Substrate thickness capabilities from 0.7mm up to 6mm
  • Water temperature up to 60 °C (140 °F

Cleaning Efficiencies

  • High Performance Substrate Cleaning
  • Detach, Removes particles via Multiple interchangeable Dynamic Cleaning Processes
  • Dual sided Roll & Disc brushes, Mach-JetTM, Ultra-Sonics, Mega-Sonic Cleaning
  • (1) Remove 95% of particles 2 µm or larger
  • (1) Prevent particles greater than 5 µm from being added
  • (1) Particles of 3 – 5 µm only increase 2 pcs or less
  • (1) Particles of 1 – 3 µ only increase by 10 pcs or less

(1) Sample data based on prior application, 500mm x 500mm, 0.5mm thick glass substrates in a class 10 clean room on pre-deposition thin film application.

Process Monitor Control

  • Panel & Cassette ID Reading / Correlated to Recipe Settings
  • TACT time per Process module, Clean Rinse, Dry ,etc
  • Panel movement and presence
  • Direction, Speed, Pressure of Brush and Wet modules
  • Motor adjustment of upper brush rollers by PLC-operating system
  • Surfactant Mix, Dispense and Recycle
  • Water Pressure
  • Data logging, Error Logging
  • Resistivity, Ph
  • Water Temperature