Toho FLX Thin Film Stress Measurement Systems offer Industry Standard capabilities for mass production and research facilities that demand accurate stress measurements on various films and substrates. Incorporating KLA-Tencor’s patented “Dual Wavelength” technology, Toho FLX Series tools precisely determine and analyze surface stress caused by deposited thin films.
FLX systems resolve problems such as metal and dielectric film cracking, voiding, and lifting formation. Equipped with a heating element for stress monitoring at high temperatures and an optional cooling unit that allows a thorough understanding of film properties at temperatures from –65°C to 500°C, the Toho FLX systems offer outstanding value in a variety of comprehensive Stress Measurement Solutions.