Precision Wet Process

Clean, Etch and Strip Process Equipment for Display and Architectural Glass


Precision Stripping

Best in Class Practices Cutting Edge Methodologies


Cassette / Equipment Cleaning

Customized Equipment Produces Clean, Dry Components


Post Process Cleaning

Customized Substrate Cleaning Systems Over 300 Precision Cleaners


Precision Developing

Toho Development Applications Optimum development uniformity and process control


Photo Mask Cleaning

Utilized in Display Fabs Customized to Meet Budget and Application Needs


Precision Etching

Uniform Wet Etch Process Fully Programmable, Comprehensive Control

Toho Precision Equipment Cleaners

Toho Cassette and Fab Equipment Parts Cleaning systems have achieved over 85% market share in leading FPD facilities around the world as a result of the second to none performance and cleaning efficiencies. Prevent “yield killer” Cross Contamination with Toho’s line up of custom made cleaning systems that can handle odd size racks, cassettes, and hard to clean deposition equipment assemblies. Toho realizes that while some applications are focused on sub-micron particle removal, others demand robust throughput at economical price points. Toho Technology Wet Process Solutions offer outstanding value with additional benefits that make Toho the clear best choice for long term intensive performance.

Cutting Edge Wet Process Methodologies

By combining automation with centrifugal force, high temperature, high pressure DIW and ultra-clean forced hot CDA, Toho Cassette and Equipment cleaners offer optimum cleaning efficiencies that produce contaminant free, clean, dry Cassettes and Components, ready for use with rapid TACT time results. Toho fully automated centrifugal force systems provide closed chamber cleaning with many of the following features.

Common Modular Process Configuration

1. MGV or Manual loading

2. Loader Conveyor

3. Cassette / Read / Record

4. Conveyance system

5. Alkaline/acidic cleaning or Chemical Free Cleaning

6. High Pressure heated Rinse with separate supply of the final cascade module

7. Final DIW Rinse

8. Air Knife high pressure CDA or N2

9. Ionizers in critical ESD control areas – Unload module

10. Un-Load / Load Conveyor

11. Mitsubishi PLC controlled / Touch panel /Signal Tower

12. Warm air flow downward, circulated

13. HEPA filter behind the heater keeps warm air clean.

Optional Process Configuration

• Front Load or Side load systems

• Immersion / DIP tank

• Agitation / Immersion combinations

• Fully Programmable / spin rate, temperature, air flow

• Average 8~10 minute clean / dry time

• CO2 insertion system for ESD suppression

• CIM / Host PC interface

Toho Quality Build

• Conveyor drive unit located outside for clean air

• Dryer unit located outside furnace area and extracts exhaust

• Warm air flows downward eliminate particle flow

• Easy access Maintenance openings

• Fully enclosed Process Chambers

• Positive air pressure

• Built in exhaust

• Safety light curtains at openings

• Multiple safety interlocks, leak sensors, exhaust sensors, over-heat, dry pump and other built in safety systems

• Effective particle filtering system

Customized for Different Applications

Toho Cassette and Parts cleaning Systems are all custom built with customer applications and specifications driving our technology and innovation. We realize that while some applications are focused on sub-micron particle removal, others demand robust throughput at economical price points. Common applications served by Toho Cleaning Systems include;

Clean Room Compatible

• TFT Cassette

• Cell Cassettes

• Color Filter Cassettes

• Wire & Magazine Cassettes

• Deposition Chamber Parts and Accessories

• Other Industrial parts cleaning

Low Throughput Requirements

• Stand Alone Manual Clean

• Spin Clean

• Limited Foot Print “Double Decker” Clean

• Manual Load /Unload

• Bacteria Prevention to eliminate water born contaminants

Long Term Value

Toho Technology Wet Process Solutions offer outstanding value with additional benefits that make Toho the clear best choice for long term value and performance. High-performance cleaning equipment with Toho process technology ensures best cleaning results. Process Engineers who select Toho Equipment enjoy product enhancements and benefits such as;

Outstanding Customer Support

• Maintenance & Operations Training at Source & Site acceptance

• Training for all Preventative Maintenance & Repair techniques

• Bilingual Assistance as needed

• Trained Service Technicians on-site during and after installations

• Local US Service Technician Presence

• Optional Remote Access software for troubleshooting and programming assistance

• PLC programming support

• Global Compliance

  • NFPA codes and regulations, NEC, OSHA
  • CE Compliance as needed
  • SEMI S2-93A

Engineered for Quality & Performance

• Designed with Japanese Quality Standards and attention to detail and workmanship

• Low Cost of Ownership with best in class material grades

• User Friendly Software Interface customized to unique applications

• Reduced Environmental impact with noise suppression, filtration systems and re-circulation systems

• N2 Purge to Prevent bacteria build up

• ESD Suppression with Ionizer bars at Un-Load

• Automatic Chamber cleaning

• Automatic line purge

Flexible Modular Configurations

• Engineered for throughput, facility requirements

• Full Pre-Assembly Spec Review for customer Engineering and Material changes

• In-line roller conveyor automated systems

• Lower Throughput Applications

• Stand alone systems

• Limited footprint requirements

• Manual Load / Unload

• Bacteria Prevention systems to stop water born contaminants

Modular Design

Toho Technology Wet Process Solutions meet stringent specifications designed for the semiconductor industry but allow for modular customization to fit all applications. While each machine is engineered at the component level to meet individual customer requirements, Toho systems offer outstanding reliability and flexible process control. User Programmable features ensure consistent processing and monitoring while a wide variety of adjustable parameters allow for optimum utilization of Fab assets.

Full Range Spec Capabilities

• Substrate sizes up to G10

• Substrate thickness capabilities from 0.7mm up to 6mm

• Water temperature up to 60 °C (140 °F)

• Toho Cassette Cleaners maintain Class 100 environments

Cleaning Efficiencies

• Spin revolution and high pressure shower clean the cassettes efficiently

• Detach, Removes particles via Multiple interchangeable Dynamic Cleaning Processes

• Capable of Cleaning Difficult “hard to reach” clean areas

• Inner nozzles effectively clean panel shelves and corners where particles collect

• Spin cleaning with nozzles hitting interior and exterior

• High pressure up to 15kg/cm2 possible (normally at 10kg/cm2)

• Inner nozzle can be mounted on either the ceiling or the sides

Process Monitor Control

• Cassette ID Reading / Correlated to Recipe Settings

• TACT time per Process module, Clean Rinse, Dry ,etc

• Cassette movement and presence

• Direction, Speed, Pressure of Brush and Wet modules

• Motor adjustment by PLC-operating system

• Surfactant Mix, Dispense and Recycle

• Water Pressure

• Data logging, Error Logging

• Water Temperature

Options and Accessories

3D Analysis Software Upgrade

Callibration Mirror Standards

Wafer Stress Pair Calibration Standards

Gas Panel

Vibration Table / Accessories

Extended Warranty


Low-Temperature Module

Odd-size Rings and Adapters

Want More Information?

Andy Slater
Head of Sales

With over 20 years of experience with Toho Technology, Andy is your go-to person for all product questions.

Email Andy

Phil Slater
Service Manager

Need to troubleshoot or schedule a service call? Phil and the Toho technicians are ready to help.

Ask Phil