Precision Wet Process

Clean, Etch and Strip Process Equipment for Display and Architectural Glass

Toho Precision Cleaners

Toho Precision Cleaners have met the demands of an ever changing market place for over 30 years. The need to achieve high cleaning efficiency on substrates of all sizes, shapes, thicknesses and materials means that customer needs drive the design and function of our products. Toho realizes that while some applications are focused on sub-micron particle removal, others demand robust throughput at economical price points. Toho Technology Wet Process Solutions offer outstanding value with additional benefits that make Toho the clear best choice for long term intensive performance. Toho is an approved vendor for all leading Asian glass manufacturers, two (2) major Medical Imaging Sensor manufacturers in the United States as well as Architectural and Dynamic glass manufacturers. In-Line and Spin Models for virtually any size glass are available.

Features

Modular Configuration

Robot Load / Un-load, Manual Load, Indexed Elevator, Loader Conveyor
Cassette / Panel ID Read, Record
Conveyance system with lateral guides
UV Excimer Cleaner to remove Organic substances
Alkaline/acidic cleaning or Chemical Free Cleaning
Brush Cleaning (Disc or Roll) (Surfactant Application)
Cascade Rinse with separate supply of the final cascade module
Mach Jet™ – for sub µm particles / special nozzle mixes 0.5MPa DIW and 0.4MPa CDA
Final DIW Rinse
Air Knife high pressure CDA or N2
Un-Load

Quality Build

Modular PP Construction
Easy access Maintenance openings
Double glass covers
Fully enclosed Process Chambers
Positive air pressure
Built-in exhaust
Multiple safety interlocks, leak sensors, exhaust sensors, over-heat, dry pump and other built-in safety systems
Effective particle filtering system

Optional Processes

Spin Wash, Rinse, Dry instead of In-Line system

Auto Width Adjustments for Various Panel Sizes
Nearly contact-free conveyance system
HPMJ: “Hyper Pressure Mach Jet” shower for maximum particle removal
CO2 insertion system for ESD suppression
Integrated Air Knife blower
HEPA filtration
Bacteria Prevention systems to stop water born contaminants
Ionizers in critical ESD control areas – Unload module
Safety light curtains at openings
CIM / Host PC interface
Wet Etch, Strip, Cassette Cleaners

Benefits

Customizable

Engineered for throughput, facility requirements
Full Pre-Assembly Spec Review for customer Engineering and Material changes
In-line roller conveyor automated systems
Lower Throughput Applications
Stand alone systems
Limited footprint requirements
Manual Load / Unload
Bacteria Prevention systems to stop water born contaminants

Outstanding Customer Support

Maintenance & Operations Training at Source & Site acceptance
Training for all Preventative Maintenance & Repair techniques
Bilingual Assistance as needed
Trained Service Technicians on-site during and after installations
Local US Service Technician Presence
Optional Remote Access software for troubleshooting and programming assistance
PLC programming support
Global Compliance
NFPA codes and regulations, NEC, OSHA
CE Compliance as needed
SEMI S2-93A

Engineered for Quality Performance

Designed with Japanese Quality Standards and attention to detail and workmanship
Low Cost of Ownership with best in class material grades
User Friendly Software Interface customized to unique applications
Reduced Environmental impact with noise suppression, filtration systems and re-circulation systems
N2 Purge to Prevent bacteria build up
ESD Suppression with Ionizer bars at Un-Load
Automatic Chamber cleaning
Automatic line purge

Applications

Displays / Clean Room

Incoming Glass Clean
Pre-Lithography Clean
Pre-Deposition
Pre-Etch Clean
Cover Glass Clean
Post Scribe Clean

Architechtural / Industrial

Incoming Clean (removal of packing materials, grease, shards, etc)
Pre-Process Clean
Clean Polish & Clean Combination Machines
Post-Process Clean

R&D / Low Through-Put

Stand Alone Manual Clean
Spin Clean
Limited Foot Print “Double Decker” Clean
Manual Load /Unload
Bacteria Prevention to eliminate water born contaminants

Specifications

Full Range

Substrate sizes up to G10
Optional Multiple size glass on one Cleaner
Substrate thickness capabilities from 0.7mm up to 6mm
Water temperature up to 60 °C (140 °F

Cleaning Efficiencies

High Performance Substrate Cleaning
Detach, Removes particles via Multiple interchangeable Dynamic Cleaning Processes
Dual sided Roll & Disc brushes, Mach-JetTM, Ultra-Sonics, Mega-Sonic Cleaning
(1) Remove 95% of particles 2 µm or larger
(1) Prevent particles greater than 5 µm from being added
(1) Particles of 3 – 5 µm only increase 2 pcs or less
(1) Particles of 1 – 3 µ only increase by 10 pcs or less

(1) Sample data based on prior application, 500mm x 500mm, 0.5mm thick glass substrates in a class 10 clean room on pre-deposition thin film application.

Process Monitor Control