Wafer Etching

Toho Technology provides state of the art high precision Etching Systems focused on wafer processing. Toho Wet benches offer linear batch immersion systems designed specifically for low cost high throughput operations around the world. Toho Technology Wet Process Solutions offer outstanding value with additional benefits that make Toho the clear best choice for long term intensive performance. Providing Etching and stripping applications commonly found in the Semiconductor, MEMS, Photonics, Solar Cell, Disc Drive and Flat Panel Display manufacturing industries, Toho is an approved vendor for leading wafer producers in Japan, China and the United States. Accommodating dry in and dry out batch wafer processing for sizes up to 300mm with customized configurations that combine cascade showers, robotic transfer, multi-step processing and SECS/GEM capabilities, Toho Etch systems provide value and performance.

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(773) 583-7183
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Toho’s worldwide experience boasts an sizeable installed base of Wafer Etching systems that allow Plant Managers and Process Engineers alike to benefit from “best in class practices” and cutting edge Wet Process methodologies. The common modular process configurations below are enhanced and customized to meet budget and application needs while taking advantage of second to none quality manufacturing and “kaizen” production methods developed in Japan for the Asian Wafer & Flat Panel Display industries.

Common Modular Process Configuration

1. Robot Load / Un-load, Manual Load

2. FOUP ID Read, Record

3. Conveyance system with lateral guides

4. Cascade Rinse with separate supply of the final cascade module

5. Final DIW Rinse

6. Air Knife high pressure CDA or N2

7. Un-Load

Optional Process Configurations

• Recirculation, Agitation, Flush/Drain systems

• Megasonic or ultrasonic baths, recirculation and filtration

• Heater, chiller and dryer options

• Wafer carrier cassette options

• HEPA filtration

• SECS/GEM Interface Options

• Automatic bulk chemical distribution

• Automatic or manual doors

• Safety light curtains at openings

• CIM / Host PC interface

Toho Quality Build

• Optional construction grade materials

• UL listed electrical components

• Easy access Maintenance openings

• Fully enclosed Process Chambers

• Positive air pressure

• Built in exhaust

• Multiple safety interlocks, leak sensors, exhaust sensors, over-heat, dry pump and other built in safety systems

Toho Technology Wet Process Solutions meet stringent specifications designed for the semiconductor industry but allow for modular customization to fit all applications. While each machine is engineered at the component level to meet individual customer requirements, Toho systems offer outstanding reliability and flexible process control. User Programmable features ensure consistent processing and monitoring while a wide variety of adjustable parameters allow for optimum utilization of Fab assets.

Full Range Spec Capabilities

• All wafer sizes, thicknesses and materials

• High Performance Wafer Cleaning

Process Monitor Control

• FOUP ID Reading / Correlated to Recipe Settings

• TACT time per Process module, Etch, Rinse, Dry ,etc

• Movement and presence sensors

• Direction, Speed, Pressure of Modules

• Etchant Mix, Dispense and Recycle

• Water Pressure

• Data logging, Error Logging

• Resistivity, Ph

• Bath Temperature

Toho Technology Wet Process Solutions offer outstanding value with additional benefits that make Toho the clear best choice for long term value and performance. High-performance etching equipment with Toho process technology ensures best etching results. Process Engineers who select Toho Equipment enjoy product enhancements and benefits such as;

Outstanding Customer Support

• Maintenance & Operations Training at Source & Site acceptance

• Training for all Preventative Maintenance & Repair techniques

• Bilingual Assistance as needed

• Trained Service Technicians on-site during and after installations

• Local US Service Technician Presence

• Optional Remote Access software for troubleshooting and programming assistance

• PLC programming support

• Global Compliance

  • NFPA codes and regulations, NEC, OSHA
  • CE Compliance as needed
  • SEMI S2-93A
  • UL listed electrical components

Engineered for Quality & Performance

• Designed with Japanese Quality Standards and attention to detail and workmanship

• Low Cost of Ownership with best in class material grades

• User Friendly Software Interface customized to unique applications

• Reduced Environmental impact with noise suppression, filtration systems and re-circulation systems

• Automatic line purge

Flexible Modular Configurations

• Engineered for throughput, facility requirements

• Full Pre-Assembly Spec Review for customer Engineering and Material changes

• Lower Throughput Applications

• Stand alone systems

• Limited footprint requirements

• Manual Load / Unload

Always an ever changing dynamic market place, the need to achieve Etch Uniformity and Control on Wafers of all sizes, thicknesses and materials means that customer needs must drive the design and function of our products. Customized to meet customer demands, Toho Wafer Etcher are used in a variety of common and custom applications.

• Wafer Texturing

• Create roughened surface to reduce light lost from reflection

• Oxide Etch and stripping

• Metals Etch on Patterned Wafer (Ag, Ni, Cr, TiW, Cu, Al)

• Wafer Thinning & Stress Relief

• Wafer Thinning & Texturing

• Pre-Deposition Treatment Etch